The diffusion welding behavior of single - crystalline cu to single - crystalline - aio with a nb film interlayer and the joint microstructure properties were studied by tem , sem / eds analyses and four - point bend testing . the nb film interlayer deposited by electron beam evaporation on the ceramic side prior to diffusion welding was found to be olycrytalline and fiber - textured after diffusion bonding , with the close - packed plane ( 110 ) being parallel to the ( 0001 ) basal plane of - aio 扩散连接技术是一门边缘科学，涉及材料、扩散、相变、界面反应、接头应力应变等各种行为，工艺参数多，虽然已经进行了大量的试验研究，但却对各种材料的连接机理尚未有明确的认识，为此人们试图借助于计算技术，对接头行为进行数值模拟，以便找到共同规律，对扩散连接过程及质量进行预测与实时控制。
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